Layer Count: 6L
Board Thickness: 1.0mm
Panel Dimension:172*150mm/50up
Material: FR4
Copper on board surface: 35μm
Min Hole Diameter: 0.25mm
Min line Width/Space: 7/7mil
Surface Finish: ENIG with 2μ''
Why Choose Us?
- Professional PCB fabrication team -all engineers have years’ experience in PCB manufacturing field
- Advanced equipment and high precision inspection & testing tools
- Top raw materials including CCL (Copper Clad Lamination), chemistry, and solder mask ink & legend ink
- Skilled operators with good command of all CCPs (Critical Control Points)
- Full set of surface finish equipment can do ENIG, immersion silver, immersion Tin, OSP, HASL (lead free), plating gold and plating silver without outsourcing risk.
- Cutting edge printed circuit board manufacturing process capacities
- Max aspect ratio reaches to 10 : 1
- Max copper weight on double PCB surface can reach to 6OZ
- The thickness of solder mask can control to 50μm
- Min Impedance control value is 50ohm +/- 5%
- Min NC drilling diameter 0.2mm and min laser drilling diameter is 0.1mm
- Circuit board manufacturing strictly as per IPC standards and make sure 100% qualified
- Strictly perform PDCA (Plan-Do-Check Action Cycle) process, and continuously improve product performance
- Leading outstanding enterprise of energy saving and environmental protection
And demand of circuit board manufacturing, click here for quick quote.
